Outpost24 to Host Educational Seminar at 2010 e-Crime Congress.
KARLSKRONA, Sweden - March 16, 2010 - Outpost24, the Technology Leader in On-Demand Vulnerability Management solutions, today announced that it will host an educational seminar at the 2010 e-Crime Congress in London. Based on a recent study which examines the level of network security in organizations today, this educational seminar focuses on what businesses are doing to improve network security, what areas are being neglected, how hackers are cashing in on common vulnerabilities in applications and operating systems, and how its caused businesses significant losses.
Outpost24's Chief Technology Officer, Ron Perris, will be presenting the findings from the study. Delegates that attend this educational seminar will learn how organizational growth and faster technology cycles create problems for vulnerability management, what are the most common vulnerabilities in applications and operating systems, what to look for when choosing a vulnerability management solution, how hackers find weaknesses in corporate networks and how to compete with professional hackers.
About the 2010 e-Crime Congress
The 2010 e-Crime Congress is a two day event in which methods to combat cyber-threats and electronic crime are discussed by experts and over 500 delegates from FTSE 100 companies, global businesses, government agencies, and international law enforcement.
When: March 16th and 17th, 2010.
Where: Victoria Park Plaza Hotel, London, UK.
More Information: http://www.e-crimecongress.org/ecrime2010/website.asp?page=edu_sem#OutpostES4.
About Outpost24
Outpost24 is the technology leader in on-demand vulnerability assessment and management solutions with over 1,000 corporate and government customers, including Travelex, Delta Lloyd Group, ING Life Limited, University of Helsinki, and Deloitte. Outpost24 is headquartered in Sweden with a global network of local sales offices. Outpost24 delivers security solutions in a Software-as-a-Service (OUTSCAN® & OUTSCAN PCI®) or Appliance (HIAB®) form factor.
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